XYtronic-USA EF-6100-R is a high-reliability, IPC, Bellcore, and JIS compliant, low solids, no-clean rework flux. It has been designed with a wide thermal process window enabling best-in-class productivity with Pb-Free soldering applications, and is an excellent choice for remaining tin-lead production lines.

•  Exhibits exceptional electrical reliability for a low-solids wave soldering flux.
• Complies with IPC-J-STD-004 SIR, Bellcore SIR, Bellcore ECM, JIS ECM, and JIS SIR.

•  Thermally stable activators provide minimized solder bridging in a low-solids, no-clean flux for both lead-free and tin-lead rework applications.

•  Reduces the surface tension between solder mask and solder to resist solder ball formation.

•  Very low level of non-tacky residue to reduce interference with pin testing. Exhibits no visible residues.

•  IPC-J-STD-004 Classification: ORL0

  Parameters	Typical Values	Parameters/Test Method	Typical Values
  Appearance	Clear, colorless liquid	Bellcore SIR	Pass
  Solids Content, % by wt	4.3	JIS, IPC	Being Tested
  Acid Number (mg KOH/g)	26.2 ± 1.3	ECM: Bellcore/IPC	Being Tested
  Specific Gravity @ 25°C (77°F)	0.818 ± 0.003	ECM: JIS	Being Tested
  Flash Point, T.C.C.	60F (15.6°C)	IPC J-STD-004 Designation	ORL0
  pH (5% aqueous solution)	3.2	Shelf Life	12 Months