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Item Details
XYtronic Halide Free RMS No-Clean Liquid Flux-16oz. Item Name:
XYtronic Halide Free RMS No-Clean Liquid Flux-16oz.
Item #:
XY-EF-8300-LF16
Average Rating:


High Activity, Lead-free/SnPb RMA No-Clean Liquid Flux - 16oz.

EF-8300 is a rosin-containing, alcohol based flux designed to optimize solderability and reliability. It is formulated for both standard and thicker, high-density PCBs in both Lead-free (standard SAC and Low Ag SAC alloys) and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFPs, as well as provide superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.

 

Features for Lead-free

  • Low bridging performance on connectors.
  • Good micro-solder ball performance in Lead-free applications
  • Pin testable
  • Specifically designed for use on Cu-OSP PCBs

Benefits:

  • Excellent Lead-free soldering performance on various board finishes.
  • Evenly spread, tack free residue.
  • Capable for high density as well as general purpose Lead-Free soldering processes.
  • Can be used in Lead-free or SnPb processes
  • Halide free

PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.

EF-8300 is a no-clean flux and the residues are designed to be left on the board. If desired, flux residues can be removed with MG Chemicals 4140 Flux remover cleaner and with other commercially available solvent cleaners and saponifier cleaners.

 Physical Properties

 EF-8300

 Parameters/Test
Method

Typical Values 

Appearance

 Clear, Pale Yellow Liquid

 pH, 5% v/v aqueous solution

 3.0

 RMA

 No-Clean

 

 

 Shelf Life

 

 

 12 months

Acid Number (mg KOH/g

 

IPC J-STD-004 Designation

 ROM0

 Flash Point (T.C.C.)

 

 Bellcore SIR

 PASS

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