High Activity, Lead-free/SnPb RMA No-Clean Liquid Flux
EF-8300 is a rosin-containing, alcohol based flux designed to optimize solderability and reliability. It is formulated for both standard and thicker, high-density PCBs in both Lead-free (standard SAC and Low Ag SAC alloys) and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFPs, as well as provide superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.
Features for Lead-free
- Low bridging performance on connectors.
- Good micro-solder ball performance in Lead-free applications
- Pin testable
- Specifically designed for use on Cu-OSP PCBs
Benefits:
- Excellent Lead-free soldering performance on various board finishes.
- Evenly spread, tack free residue.
- Capable for high density as well as general purpose Lead-Free soldering processes.
- Can be used in Lead-free or SnPb processes
- Halide free
PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.
EF-8300 is a no-clean flux and the residues are designed to be left on the board. If desired, flux residues can be removed with MG Chemicals 4140 Flux remover cleaner and with other commercially available solvent cleaners and saponifier cleaners.
|
Physical Properties |
EF-8300 |
Parameters/Test
Method |
Typical Values |
|
Appearance |
Clear, Pale Yellow Liquid |
pH, 5% v/v aqueous solution |
3.0 |
|
RMA |
No-Clean |
|
|
|
Shelf Life |
|
|
12 months |
|
Acid Number (mg KOH/g |
|
IPC J-STD-004 Designation |
ROM0 |
|
Flash Point (T.C.C.) |
|
Bellcore SIR |
PASS |
